3DiS Technologies
Created in 2014
- BETA
Up & running (A)
Existing signals show a regular activity Social networks
7 174Activities
Technologies
Entity types
Location
478 Rue de la Découverte, 31670 Labège, France
Labège
France
Employees
Scale: 2-10
Estimated: 4
SIREN
802052993Engaged corporates
0
0 0Added in Motherbase
1 year, 7 months ago
industry 4.0 Value proposition
3DiS Technologies is a service provider of semiconductor packaging design and assembly using an innovating 3D interconnect technology. This technology enables high performance 3D inductive passive device implementation beside or above IC, as well. Based on a reduced number of technological steps and perfectly adaptable to the constraints of the client's application, the proposed process is ideal for System-in-Package, Wafer-Level-Packaging and above-IC inductive device integration. Our cost effective solution reduces time-to-market and leads to miniaturized and more efficient electronic systems.
3D Electronics Packaging, 3D Interconnects, 3D Inductive Passive Devices, and 3D IPDOriginal language
3DiS Technologies is a service provider of semiconductor packaging design and assembly using an innovating 3D interconnect technology. This technology enables high performance 3D inductive passive device implementation beside or above IC, as well. Based on a reduced number of technological steps and perfectly adaptable to the constraints of the client's application, the proposed process is ideal for System-in-Package, Wafer-Level-Packaging and above-IC inductive device integration. Our cost effective solution reduces time-to-market and leads to miniaturized and more efficient electronic systems.
3D Interconnect, 3D Packaging & 3D-IPD Solutions | 3DiS Technologies
Innovative 3D interconnect technologies for Wafer-Level integration of 3D System-in-Package and high performance 3D integrated passive devices (3D-IPD) | 3DiS Technologies
https://www.3dis-tech.com/
